S-parameters for Broadband Analog/High-Speed Digital Designs Course

Background

Scattering parameters (S-parameters) carry fundamental importance in RF, microwave and high-speed digital designs.

Their mathematical properties, such as magnitude, phase and combined matrix representation, provide the designer essential insights for the analysis and design of broadband devices, PCBs and packages. The concept of S-parameters originated from microwave network theory and distributed systems. Yet, with the rising data rates of today's digital interfaces, S-parameters analysis becomes not only the property of microwave engineers, but also for high-speed digital engineers.

In this course, the fundamental properties of scattering parameters will be studied, both single-ended as well as mixed mode, differential and common. The study will include their mathematical derivation, properties and their use in PCB and package analyses such as attenuation, reflections, crosstalk, mode conversion, dispersion, ground bounce and others. The aim of the course is to provide the course participants with extensive practical and theoretical knowledge in order to understand and use S- parameters in their designs.

Due to the dual use of S-parameters in microwave and high-speed digital applications, this course can be suitable for both microwave engineers as well as high-speed digital designers and signal integrity engineers.

The topics include:

• Extensive S -parameters practice and theory.

• Design, analysis and measurement of PCB and package high-speed elements using S parameters.

• Dozens of examples from simulations and network analyzer measurements. 

• Proof of design and failure investigation using S- parameters.

• Familiarizing with S -parameters simulation and measurement tools.

• Defining how much reflection, attenuation, xtalk and mode-conversion is too much by using S parameters.

• Briefing on data sheets and common specifications.

Presenter

Dror Haviv received his Master of Science (M.Sc) degree in electrical engineering with honors from the Electromagnetic and Microwave program

at Ben-Gurion University (Beer-Sheva, Israel). He is one of Israel’s leading Signal and Power Integrity (SI/PI) engineers and has years of design, analysis, measurement, and teaching experience in the signal integrity field behind him.

Today, Dror serves as a Technologist at the Signal and Power Integrity team at Western Digital ASIC platform engineering organization.

His job duties include flash controllers’ signal and power integrity design, silicon die and package co-design, modeling, system level signal and power integrity simulations and correlation analysis of die/package SI/PI parameters between simulation and measurement results.

From 2010-2019, Dror served as signal integrity focal point and architect with Rafael’s R&D division. As a signal integrity architect, he designed, analyzed, simulated, and measured dozens of systems and PCBs for high-speed interfaces. As focal point, he has qualified, educated, trained, and supervised many engineers in the signal integrity field. Simultaneously, he served as a senior signal integrity cooperate researcher and has conducted several research projects in the field. His research has been presented in conferences on signal integrity, both in Israel and abroad.

Target  Audience 

All professional engineers that are involved in design, qualification and manufacturing of products which contain high frequencies/ high-speed interfaces, such as: RF, microwave, board design, signal integrity, layout, verification, integration, system and process manufacturer engineers.

Course Structure

The course includes extensive practical and theoretical background, examples from simulations and measurements, open discussions, briefing on common specifications etc.

 

Opening Date and Format:

36 hours in total, Four daily sessions:
17 October  2021, 18 October 2021,  24 October 2021,  25 October 2021 | 8:30-17:30